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第一顆電晶體(Transistor)的由來

第二次世界大戰末期,貝爾實驗室開始一項研究計畫,目標是研發出一種體積更小、功能更強大、更快速且可靠的裝置來取代真空管。1947年12月23日,由貝爾實驗室研發的電晶體取代了真空管,優點是體積更小、更可靠、且成本低廉,不僅孕育了今日遍及全球的電子半導體產業,同時也促成電訊電腦業、醫學、太空探測等領域產生戲劇性的改變。
Xilinx廣泛部署動態可重組技術 (2017.04.21)
美商賽靈思(Xilinx)推出的Vivado設計套件HLx 2017.1版中廣泛納入部分可重組 (Partial Reconfiguration) 技術,為包括有線與無線連網、測試與量測、航太與國防、汽車、及資料中心等廣泛領域的應用,提供動態的現場升級優勢以及更高的系統整合度
車載新時代 產業新契機 (2017.04.21)
未來資訊相關之資安問題將是下一個必須重視之重點,建議未來必定要重視資訊安全議題,此部分或許是我國切入車載市場之契機…
Silicon Labs’s New Turnkey USB-to-I2S Bridge Chip (2017.04.21)
Silicon Labs has introduced a fixed-function audio bridge device that provides a simple, turnkey solution for transferring digital audio data between the universal serial bus (USB) and integrated inter-IC sound (I2S) serial bus interfaces
Hyundai Mobis Starts Local Production of Main Auto Components (Lamps) in Europe (2017.04.21)
Hyundai Mobis announced on April 18th that it has opened a new lamp plant in the Czech Republic and commenced lamp production. Hyundai Mobis plans to make this plant as a production base for main auto components for the European market
IR Sensor Modules for Mobile to Reach US$145M in Scale This Year, Says TrendForce (2017.04.21)
Among the possible new technologies to be incorporated in this year’s refresh of the iPhone series, 3D sensing has generated a lot of interests in terms of applications. A 3D sensing solution requires an RGB camera module an infrared (IR) sensor module that uses VCSEL (vertical-cavity surface-emitting laser) as a light source
整合車用產品技術 TI提升環保/安全/駕駛體驗 (2017.04.20)
隨著先進駕駛輔助系統(ADAS)與自駕車的議題日熾,也為半導體產業帶來許多商機;根據市調機構IC Insights預估,車用市場從2015年至2020年複合成長率將達4.9%,為半導體產業帶來龐大的市場機會
Leading Taiwanese Industrial Firms to Showcase Their Latest Innovations at the 2017 Hannover Messe (2017.04.20)
TAIPEI, Taiwan - The Taiwan External Trade Development Council (TAITRA) announced today that at the Taiwan Excellence press conference leading Taiwanese industrial and technology companies Delta Electronics, HIWIN Technologies, HIWIN Microsystems, and Tatung will introduce their companies and showcase their latest innovations
HARMAN and Baidu DuerOS Collaborate on AI Solutions for China Automotive Market (2017.04.20)
HARMAN International, a wholly-owned subsidiary of Samsung focused on connected technologies for the automotive, consumer and enterprise markets, is pleased to announce it has expanded its relationship with Baidu, the leading Chinese Internet and web services company, to jointly develop new cloud-based artificial intelligence (AI) solutions aimed at Chinese automakers
USB轉I2S橋接晶片為數位音訊設計提供完整解決方案 (2017.04.20)
Silicon Labs (芯科科技)推出具備固定功能的音訊橋接元件,為在USB和I2S串列匯流排介面之間傳輸數位音訊資料提供簡單、完整的解決方案。新型CP2615數位音訊橋接器簡化了USB轉I2S的連接
Broadcom Introduces First Fully Compliant TSN Ethernet Switch (2017.04.20)
Broadcom today introduced the BCM53570 Ethernet switch family that is the industry’s first to offer full compliance with all available IEEE Time Sensitive Networks (TSN) standards. Broadcom StrataConnect BCM53570 family of switches with full TSN compliance brings determinism to Ethernet, expanding Ethernet’s use in established markets as well as enabling Ethernet’s growing presence in new untapped markets
SmarTEX Exhibit at COMPUTEX 2017 to Showcase Latest IoT Innovations (2017.04.20)
Following its very successful debut at COMPUTEX 2016, SmarTEX will again provide a glimpse of future lifestyles and commerce made possible by IoT. At SmarTEX, attendees will find IoT applications in trending information and communications technology (ICT) categories including security solutions, smart home and entertainment, wearables, Internet of Vehicles (IoV), automotive electronics and smart technology solutions
車電展登場 瑞薩:台廠可從兩大技術著手切入ADAS應用 (2017.04.19)
2017「台北國際汽車零配件展與台北國際車用電子展」於今(19)日登場,全球最大車用MCU與SoC產品供應商日本瑞薩電子也參與其中,並向台灣媒體揭露其在台車用市場相關佈局,以及該公司針對車用市場的現況發展
搶攻車用電子商機 工研院大展節能車輛技術 (2017.04.19)
看好車用電子市場商機,工研院於2017台灣國際車用電子展中展示出皮帶式啟動發電機、駕駛感知融合平台、遠距浮空多屏抬頭顯示器、馬達驅動應用碳化矽智慧功率模組,以及車載同步整流發電機等成果
Samsung Completes Qualification of Its 2nd Generation 10nm Process Technology (2017.04.19)
Samsung Electronics announced today that its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus), has been qualified and is ready for production. With further enhancement in 3D FinFET structure, 10LPP allows up to 10-percent higher performance or 15-percent lower power consumption compared to the first generation 10LPE (Low-Power Early) process with the same area scaling
HARMAN (2017.04.19)
HARMAN International, a wholly-owned subsidiary of Samsung, announced today a new platform solution that intelligently integrates all of a car’s digital displays and the information and services behind them. HARMAN’s new Digital Cockpit Platform is a scalable and cost-effective solution that integrates the operation and functionality of the instrument cluster and center stack infotainment system to deliver a more seamless user experience
NVIDIA and Facebook Team Up to Supercharge Caffe2 Deep Learning Framework (2017.04.19)
NVIDIA and Facebook today announced the result of our joint work to advance artificial intelligence with Caffe2, a new AI deep learning framework contributed by Facebook to the open-source community. NVIDIA and Facebook are delivering AI acceleration through its work on the Caffe2 deep learning framework
Imec Develops Bifacial n-PERT Solar Cell with a Record 22.8% Front-Side Efficiency (2017.04.19)
imec today announced it has realized bifacial n-PERT solar cells using an industrially-compatible process with a record-setting front-side conversion efficiency of 22.8 percent. Used bifacially under standard front illuminations conditions in conjunction with an additional 0
Portwell Announces Highly Composable IoT Gateway - XM-1 (2017.04.18)
Portwell empowering the Internet of Things (IoT) with intelligent gateways and edge devices, announces XM-1, the first IoT gateway to feature international patents of highly composable structure. XM-1 satisfies customers’ requests for an IoT gateway solution that can meet the requirements emerging from an extensive range of IoT applications
TrendForce Anticipates Global Server DRAM ASP in 2Q17 to Rise Over 10% (2017.04.18)
DRAMeXchange, a division of TrendForce, reports that demand continues to outpace supply in the server DRAM market. In this first quarter, memory suppliers saw their shipment fulfillment rates dropped for different groups of clients
Taiwanese ODM Compal Becomes Another Assembly of Apple Watch (2017.04.18)
TAIPEI, Taiwan - According to the Taiwan Economic Daily that Taiwan's majoy ODM company Compal will become the second assembly plant of the Apple’s Apple Watch this year, is expected to begin mass production in the second half of this year, and is expected to obtain 20% to 30% assembly orders of Apple Watch

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5 NI:因應物聯網發展 PXI、CompactDAQ形成堅強量測組合
6 [MWC Asia] 高通:車聯網後勢漲 模組設計將是重要走向
7 NI:串聯IT與OT 將TSN應用領域最大化
8 Toshiba/WD攜手共拓3D NAND新時代
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