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CTIMES / 电子产业
科技
典故
P2P-点对点档案交换

「P2P」,简单地说就是peer-to-peer—「点对点联机软件」,意即「使用端」对「使用端」(Client to Client ) 通讯技术,能让所有的设备不用经过中央服务器,便能直接联通散布数据。
Xilinx广泛部署动态可重组技术 (2017.04.21)
美商赛灵思(Xilinx)推出的Vivado设计套件HLx 2017.1版中广泛纳入部分可重组(Partial Reconfiguration) 技术,为包括有线与无线连网、测试与量测、航太与国防、汽车、及资料中心等广泛领域的应用,提供动态的现场升级优势以及更高的系统整合度
车载新时代 产业新契机 (2017.04.21)
未来资讯相关之资安问题将是下一个必须重视之重点,建议未来必定要重视资讯安全议题,此部分或许是我国切入车载市场之契机…
Silicon Labs’s New Turnkey USB-to-I2S Bridge Chip (2017.04.21)
Silicon Labs has introduced a fixed-function audio bridge device that provides a simple, turnkey solution for transferring digital audio data between the universal serial bus (USB) and integrated inter-IC sound (I2S) serial bus interfaces
Hyundai Mobis Starts Local Production of Main Auto Components (Lamps) in Europe (2017.04.21)
Hyundai Mobis announced on April 18th that it has opened a new lamp plant in the Czech Republic and commenced lamp production. Hyundai Mobis plans to make this plant as a production base for main auto components for the European market
IR Sensor Modules for Mobile to Reach US$145M in Scale This Year, Says TrendForce (2017.04.21)
Among the possible new technologies to be incorporated in this year’s refresh of the iPhone series, 3D sensing has generated a lot of interests in terms of applications. A 3D sensing solution requires an RGB camera module an infrared (IR) sensor module that uses VCSEL (vertical-cavity surface-emitting laser) as a light source
整合车用产品技术 TI提升环保/安全/驾驶体验 (2017.04.20)
随着先进驾驶辅助系统(ADAS)与自驾车的议题日炽,也为半导体产业带来许多商机;根据市调机构IC Insights预估,车用市场从2015年至2020年复合成长率将达4.9 %,为半导体产业带来庞大的市场机会
Leading Taiwanese Industrial Firms to Showcase Their Latest Innovations at the 2017 Hannover Messe (2017.04.20)
TAIPEI, Taiwan - The Taiwan External Trade Development Council (TAITRA) announced today that at the Taiwan Excellence press conference leading Taiwanese industrial and technology companies Delta Electronics, HIWIN Technologies, HIWIN Microsystems, and Tatung will introduce their companies and showcase their latest innovations
HARMAN and Baidu DuerOS Collaborate on AI Solutions for China Automotive Market (2017.04.20)
HARMAN International, a wholly-owned subsidiary of Samsung focused on connected technologies for the automotive, consumer and enterprise markets, is pleased to announce it has expanded its relationship with Baidu, the leading Chinese Internet and web services company, to jointly develop new cloud-based artificial intelligence (AI) solutions aimed at Chinese automakers
USB转I2S桥接晶片为数位音讯设计提供完整解决方案 (2017.04.20)
Silicon Labs (芯科科技)推出具备固定功能的音讯桥接元件,为在USB和I2S串列汇流排介面之间传输数位音讯资料提供简单、完整的解决方案。新型CP2615数位音讯桥接器简化了USB转I2S的连接
Broadcom Introduces First Fully Compliant TSN Ethernet Switch (2017.04.20)
Broadcom today introduced the BCM53570 Ethernet switch family that is the industry’s first to offer full compliance with all available IEEE Time Sensitive Networks (TSN) standards. Broadcom StrataConnect BCM53570 family of switches with full TSN compliance brings determinism to Ethernet, expanding Ethernet’s use in established markets as well as enabling Ethernet’s growing presence in new untapped markets
SmarTEX Exhibit at COMPUTEX 2017 to Showcase Latest IoT Innovations (2017.04.20)
Following its very successful debut at COMPUTEX 2016, SmarTEX will again provide a glimpse of future lifestyles and commerce made possible by IoT. At SmarTEX, attendees will find IoT applications in trending information and communications technology (ICT) categories including security solutions, smart home and entertainment, wearables, Internet of Vehicles (IoV), automotive electronics and smart technology solutions
车电展登场 瑞萨:台厂可从两大技术着手切入ADAS应用 (2017.04.19)
2017「台北国际汽车零配件展与台北国际车用电子展」于今(19)日登场,全球最大车用MCU与SoC产品供应商日本瑞萨电子也参与其中,并向台湾媒体揭露其在台车用市场相关布局,以及该公司针对车用市场的现况发展
抢攻车用电子商机 工研院大展节能车辆技术 (2017.04.19)
看好车用电子市场商机,工研院于2017台湾国际车用电子展中展示出皮带式启动发电机、驾驶感知融合平台、远距浮空多屏抬头显示器、马达驱动应用碳化矽智慧功率模组,以及车载同步整流发电机等成果
Samsung Completes Qualification of Its 2nd Generation 10nm Process Technology (2017.04.19)
Samsung Electronics announced today that its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus), has been qualified and is ready for production. With further enhancement in 3D FinFET structure, 10LPP allows up to 10-percent higher performance or 15-percent lower power consumption compared to the first generation 10LPE (Low-Power Early) process with the same area scaling
HARMAN Introduces Scalable Digital Cockpit Platform for Automotive Display (2017.04.19)
HARMAN International, a wholly-owned subsidiary of Samsung, announced today a new platform solution that intelligently integrates all of a car’s digital displays and the information and services behind them. HARMAN’s new Digital Cockpit Platform is a scalable and cost-effective solution that integrates the operation and functionality of the instrument cluster and center stack infotainment system to deliver a more seamless user experience
NVIDIA and Facebook Team Up to Supercharge Caffe2 Deep Learning Framework (2017.04.19)
NVIDIA and Facebook today announced the result of our joint work to advance artificial intelligence with Caffe2, a new AI deep learning framework contributed by Facebook to the open-source community. NVIDIA and Facebook are delivering AI acceleration through its work on the Caffe2 deep learning framework
Imec Develops Bifacial n-PERT Solar Cell with a Record 22.8% Front-Side Efficiency (2017.04.19)
imec today announced it has realized bifacial n-PERT solar cells using an industrially-compatible process with a record-setting front-side conversion efficiency of 22.8 percent. Used bifacially under standard front illuminations conditions in conjunction with an additional 0
Portwell Announces Highly Composable IoT Gateway - XM-1 (2017.04.18)
Portwell empowering the Internet of Things (IoT) with intelligent gateways and edge devices, announces XM-1, the first IoT gateway to feature international patents of highly composable structure. XM-1 satisfies customers’ requests for an IoT gateway solution that can meet the requirements emerging from an extensive range of IoT applications
TrendForce Anticipates Global Server DRAM ASP in 2Q17 to Rise Over 10% (2017.04.18)
DRAMeXchange, a division of TrendForce, reports that demand continues to outpace supply in the server DRAM market. In this first quarter, memory suppliers saw their shipment fulfillment rates dropped for different groups of clients
Taiwanese ODM Compal Becomes Another Assembly Plant of Apple Watch (2017.04.18)
TAIPEI, Taiwan - According to the Taiwan Economic Daily that Taiwan's majoy ODM company Compal will become the second assembly plant of the Apple’s Apple Watch this year, is expected to begin mass production in the second half of this year, and is expected to obtain 20% to 30% assembly orders of Apple Watch

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